ligitek electronics co.,ltd. property of ligitek only data sheet lvy3330/t - 2006 07 - apr. doc. no : qw0905- rev. : date : b lvy3330/t low current round type led lamps
+ - 1/4 page part no. package dimensions lvy3330/t ligitek electronics co.,ltd. property of ligitek only 5.0 5.9 8.6 7.6 1.5max 2.54typ 1.0min directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 0.5 typ 25.0min 30 0 60 -30 -60 100% 50%75% 25% 0 25% 50% 75% 100%
2/4 page unit ma ratings 30 vy ma mw a 75 10 60 -40 ~ +100 max 260 for 5 sec max (2mm from body) -40 ~ +85 typ. 5536 max. 2 min. 2.2 20 1.8 min. 38 viewing angle 2 1/2 (deg) forward voltage @ ma(v) spectral halfwidth nm luminous intensity @2ma(mcd) absolute maximum ratings at ta=25 part no. lvy3330/t symbol i f parameter pd ir i fp power dissipation reverse current @5v peak forward current duty 1/10@10khz forward current tstg tsol storage temperature soldering temperature t opr operating temperature lens 590 emitted material yellow algainp color yellow diffused dominant wave length dnm part no lvy3330/t note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only electrostatic discharge( * ) esd2000 v static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. *
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page 3/4 part no. lvy3330/t
4/4 page ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. description mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test item operating life test high temperature storage test low temperature storage test high temperature high humidity test thermal shock test solder resistance test reliability test: part no. lvy3330/t this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2
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